MULTIBEAM LASER DEBONDING DEVICE AND METHOD

Title:

MULTIBEAM LASER DEBONDING DEVICE AND METHOD

Document Type and Number:

WIPO Patent Application WO/2020/159341

Kind Code:

A1

Abstract:

A multibeam laser debonding device of the present invention is a laser debonding device for debonding an electronic component from a substrate, and comprises: a first laser module for emitting a first laser beam to a first substrate region, which covers a predetermined range including attachment positions of an electronic component to be debonded and electronic components therearound, to heat the solder of the electronic components to a predetermined preheat temperature; and a second laser module for emitting a second laser beam overlapping the first laser beam to a second substrate region, which is a narrower region than the first substrate region and includes only the attachment position of the electronic component to be debonded, to additionally heat the solder of the electronic component to be debonded to a debonding temperature at which the solder starts to melt.

Inventors:

CHOI JAE JOON (KR)
KIM NAM SEONG (KR)
KIM BYUNG ROC (KR)
YOO JONG JAE (KR)
PARK BOO SEONG (KR)

Application Number:

PCT/KR2020/001598

Publication Date:

August 06, 2020

Filing Date:

February 03, 2020

Export Citation:

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Assignee:

LASERSSEL COLTD (KR)

International Classes:

B23K26/067; B23K26/073; B23K101/42

Foreign References:

JP2017017230A	2017-01-19
JP2004314165A	2004-11-11
JP2005085708A	2005-03-31
KR20060123128A	2006-12-01
KR20180123986A	2018-11-20

Other References: