MULTILAYER ANISOTROPIC, CONDUCTIVE ADHESIVE AND JOINING STRUCTURE USING THIS

WIPO Patent Application WO/2005/026279

A1

A multilayer anisotropic, conductive adhesive capable of exhibiting a sufficient reflowing resistance and providing easy joining, and a joining structure using this. The multilayer anisotropic, conductive adhesive (11) comprises a plurality of laminated adhesive layers (1, 2) containing at least insulating resin and hardener, wherein conductive particles are contained in at least any one adhesive layer out of a plurality of layers (1, 2), and at least top or bottom adhesive layer (1) has a DSC (differential scanning calorie) heating peak temperature of 130-180°C. A joining structure comprises a first electronic component having an electrode and an insulation film on the surface thereof, and a second electronic component having an electrode on the surface thereof and being electrically connected to the first electronic component via the above multilayer anisotropic, conductive adhesive (11).

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KUMAKURA HIROYUKI (JP)

PCT/JP2004/013484

March 24, 2005

September 09, 2004

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SONY CHEMICALS CORP (JP)
KUMAKURA HIROYUKI (JP)

C09J7/10; C09J9/02; H01R4/04; H05K3/32; (IPC1-7): C09J7/00; H01R11/01

JP2001323246A	2001-11-22
JP2001302881A	2001-10-31
JPH05320610A	1993-12-03

Tsunoda, Yoshisue (8-1 Nishishinjuku 1-chom, Shinjuku-ku Tokyo, JP)

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