Title:
MULTILAYER CERAMIC CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2023/189718
Kind Code:
A1
Abstract:
A multilayer ceramic capacitor 10 comprises: a capacitor body 11 that includes a plurality of laminated dielectric layers 12, a plurality of first inner electrodes 13a, and a plurality of second inner electrodes 13b, and that has a first main surface 15a and a second main surface 15b that are opposite to each other in a first direction, a first side-surface and a second side-surface that are opposite to each other in a second direction orthogonal to the first direction, and a first end surface 17a and a second end surface 17b that are opposite to each other in a third direction orthogonal to the first direction and the second direction; a first external electrode 14a that is provided at least to the first main surface 15a, among the surfaces of the capacitor body 11, and that is electrically connected to the first inner electrodes 13a; a second external electrode 14b that is provided at least to the first main surface 15a, among the surfaces of the capacitor body 11, and that is electrically connected to the second inner electrodes 13b; a first bump 20a that is provided to a surface of the first main surface 15a side of the capacitor body 11, among the surfaces of the first external electrode 14a, and that is formed from one of Au, Cu, and Al; and a second bump 20b that is provided to a surface of the first main surface 15a side of the capacitor body 11, among the surfaces of the second external electrode 14b, and that is formed from the same material as the first bump 20a. The external electrodes 14a, 14b are not provided to the second main surface 15b of the capacitor body 11. The external electrode 14a is provided at a position in contact with at least the first bump 20a and includes a first metal layer 141a formed from the same material as the the first bump 20a. The second external electrode 14b is provided at a position in contact with at least the second bump 20b and includes a second metal layer 141b formed from the same material as the second bump 20b. The thickness of the first bump 20a and the thickness of the second bump 20b in the first direction is 4.5 μm or more.
Inventors:
YAMATO RYUTARO (JP)
YAMADA TADATERU (JP)
SUZUKI SHOICHIRO (JP)
YAMADA TADATERU (JP)
SUZUKI SHOICHIRO (JP)
Application Number:
PCT/JP2023/010559
Publication Date:
October 05, 2023
Filing Date:
March 17, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/30; H01G4/228
Foreign References:
| JP2008537328A | 2008-09-11 | |||
| JP2009016395A | 2009-01-22 | |||
| JP2008302588A | 2008-12-18 | |||
| JPH1167585A | 1999-03-09 | |||
| JPH054451U | 1993-01-22 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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