MULTILAYER CERAMIC ELECTRONIC COMPONENT

WIPO Patent Application WO/2023/157545

A1

A multilayer ceramic electronic component comprising: a laminated structure which includes a laminated portion having ceramic layers and internal electrode layers laminated alternately, which has a substantially rectangular parallelepiped shape, in which the plurality of laminated internal electrode layers are formed so as to be alternately exposed to two opposing end surfaces, and which has an upper surface and lower surface in the lamination direction and two side surfaces in addition to the two end surfaces; and side margins which are provided so as to cover end portions of the plurality of laminated internal electrode layers extending toward the two side surfaces, which contain a ceramic as a main component, and which have a thickness of 10-70 μm inclusive. In any of the internal electrode layers, with respect to a first straight line drawn from a tip on a side margin side in the opposing direction in which the two side surfaces oppose each other, a distance in the opposing direction between the tip and one position closer to the tip from among a first position where a thickness from a surface on one side in the thickness direction first reaches a local maximum value and a second position where a thickness from a surface on the other side first reaches a local maximum value is 15 μm or less.　

KAWAMURA CHIE (JP)

PCT/JP2023/001442

August 24, 2023

January 19, 2023

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TAIYO YUDEN KK (JP)

H01M10/0585; H01G4/30; H01M4/13; H01M10/0562

WO2020111127A1

2020-06-04

JP2021108258A	2021-07-29
JP2021140899A	2021-09-16

KATAYAMA, Shuhei (JP)

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