Title:
NI ALLOY FILM AND SPUTTERING TARGET MATERIAL FOR FORMATION OF NI ALLOY FILM
Document Type and Number:
WIPO Patent Application WO/2024/075547
Kind Code:
A1
Abstract:
Provided are: a Ni alloy film that has high oxidation resistance at high temperature even without containing Cr; and a sputtering target material for forming the Ni alloy film. This Ni alloy film comprises 9.0-25.0 atom% of Al and 1.0-8.0 atom% of V, the balance being Ni and incidental impurities. The total contained amount of Al and V is preferably 11.0-30.0 atom%. The contained amount of Al is preferably 10.0-18.0 atom%. The Ni alloy film can be formed from a sputtering target material having the same composition and having a Curie point that is not higher than room temperature.
Inventors:
MURATA HIDEO (JP)
TAKUWA MOEMI (JP)
TAKUWA MOEMI (JP)
Application Number:
PCT/JP2023/034499
Publication Date:
April 11, 2024
Filing Date:
September 22, 2023
Export Citation:
Assignee:
PROTERIAL LTD (JP)
International Classes:
C22C19/03; C23C14/34
Foreign References:
| JP2010054543A | 2010-03-11 | |||
| JP2008158479A | 2008-07-10 | |||
| JP2018009233A | 2018-01-18 | |||
| JP2021075749A | 2021-05-20 | |||
| CN114318255A | 2022-04-12 |
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