Title:
ONE-COMPONENT THERMOSETTING RESIN COMPOSITION AND UTILIZATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2024/122630
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a one-component thermosetting resin composition that can provide a cured product having excellent adhesive strength by low-temperature curing and that has excellent storage stability. The one-component thermosetting resin composition contains an epoxy resin, polymer particles, dicyandiamide, and an amine adduct curing agent, each in specific amounts, has a specific exothermic start temperature and exothermic peak temperature, and also (1) contains a specific amount of a urea compound, (2) contains a specific amount of an epoxy-reactive diluent, or (3) contains a specific amount of epoxy groups in a shell layer of the polymer particles.
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Inventors:
OKAMOTO TOSHIHIKO (JP)
Application Number:
PCT/JP2023/043983
Publication Date:
June 13, 2024
Filing Date:
December 08, 2023
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08L63/00; C08K5/21; C08K5/315; C08L51/04; C08L63/02; C09J11/06; C09J11/08; C09J163/00; C09J163/02
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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