Title:
ONE-PIECE MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2012/035922
Kind Code:
A1
Abstract:
A technique whereby phosphorus compounds do not inhibit the curing of an addition reaction type silicone composition, even if the addition reaction type silicone composition comes into contact with a resin molding containing a phosphorus compound, is provided. A molded body, which is provided with a thermoplastic resin molded body containing a phosphorus compound, an addition reaction type silicone composition, and a member, and in which the thermoplastic resin molded body and the addition reaction type silicone composition come into contact, wherein a pentavalent phosphorus compound is used as the phosphorus compound. The thermoplastic resin molded body preferably contains polybutylene terephthalate resin for thermal resistance reasons.
Inventors:
SAKATA KOUICHI (JP)
Application Number:
PCT/JP2011/068614
Publication Date:
March 22, 2012
Filing Date:
August 17, 2011
Export Citation:
Assignee:
POLYPLASTICS CO (JP)
SAKATA KOUICHI (JP)
SAKATA KOUICHI (JP)
International Classes:
C08J5/12; B32B27/00; B32B27/18; C08K5/521; C08K5/5313; C08L67/02
Foreign References:
| JP2003025516A | 2003-01-29 | |||
| JP2002052667A | 2002-02-19 | |||
| JP2007009119A | 2007-01-18 |
Attorney, Agent or Firm:
SHOBAYASHI, Masayuki et al. (JP)
Right wood Masayuki (JP)
Right wood Masayuki (JP)
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Claims:
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