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Patent Searching and Data


Title:
OPTICAL MODULE AND METHOD FOR ASSEMBLING OPTICAL MODULE
Document Type and Number:
WIPO Patent Application WO/2003/081734
Kind Code:
A1
Abstract:
An optical module having at least one optical part and a package for housing the part, characterized in that it has, in the inside of the package, a joint portion formed by a Sn-Ag solder comprising 2.0 to 5.0 wt % of Ag or a Sn-Zn solder comprising 6.0 to 10.0 wt % of Zn, wherein each solder further comprises Au in an mount of 2.0 to 20.0 wt %.

Inventors:
ZAMA SATORU (JP)
MUGISHIMA TOSHIO (JP)
MITOSE KENGO (JP)
TSUZUKI YOSHIKAZU (JP)
SAKATA MASATO (JP)
Application Number:
PCT/JP2003/003012
Publication Date:
October 02, 2003
Filing Date:
March 13, 2003
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
ZAMA SATORU (JP)
MUGISHIMA TOSHIO (JP)
MITOSE KENGO (JP)
TSUZUKI YOSHIKAZU (JP)
SAKATA MASATO (JP)
International Classes:
G02B6/42; H01S5/02315; (IPC1-7): H01S5/022; G02B6/42
Foreign References:
JP2001215372A2001-08-10
JP2000280090A2000-10-10
JPH07128550A1995-05-19
JPH11295560A1999-10-29
JP2000323731A2000-11-24
JP2002232053A2002-08-16
JP2002185130A2002-06-28
JP2003124412A2003-04-25
JP2002353520A2002-12-06
Other References:
See also references of EP 1489706A4
Attorney, Agent or Firm:
Kawawa, Takaho (Mita 3-chome Minato-ku, Tokyo, JP)
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