Title:
OPTICAL MODULE
Document Type and Number:
WIPO Patent Application WO/2019/078485
Kind Code:
A1
Abstract:
The technical subject matter of the present invention provides an optical module comprising: a semiconductor package comprising an optical device, a semiconductor chip, and a wiring pattern for electrically connecting the optical device and the semiconductor chip; and a guide structure provided on a first surface of the optical device, on which a pad of the optical device is provided, and guiding an optical fiber for transmitting/receiving an optical signal to/from the optical device.
Inventors:
LEE JAE CHEON (KR)
OH DONG HOON (KR)
PARK SANG YONG (KR)
LEE JUN KYU (KR)
KIM GEON WOO (KR)
OH DONG HOON (KR)
PARK SANG YONG (KR)
LEE JUN KYU (KR)
KIM GEON WOO (KR)
Application Number:
PCT/KR2018/010272
Publication Date:
April 25, 2019
Filing Date:
September 04, 2018
Export Citation:
Assignee:
NEPES CO LTD (KR)
International Classes:
G02B6/42
Foreign References:
| JP2008015348A | 2008-01-24 | |||
| US20140270632A1 | 2014-09-18 | |||
| JP2012163649A | 2012-08-30 | |||
| JP2007057976A | 2007-03-08 | |||
| US20140072311A1 | 2014-03-13 |
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (KR)
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