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Title:
ORGANIC SILICON RESIN COMPOSITION, WHITE PREPREG AND WHITE LAMINATE USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/101537
Kind Code:
A1
Abstract:
Provided are an organic silicon resin composition, prepreg and laminate using the same. The organic silicon resin composition glue solution contains a condensed silicon resin, a catalyst, an auxiliary agent, a white filler and a solvent as necessary components, and is impregnated in a reinforced material such as a sheet-like fiberglass fiber base material and then dried to prepare the prepreg. The prepreg has a net structure via crosslinking of the silicon resin using a condensation reaction. Since the organic silicon resin has ultrahigh heat resistance and yellowing resistance, the present invention applies the silicon resin to a white LED copper-clad laminate instead of a traditional organic resin, satisfying the demand for high heat resistance, and replacing the ceramic substrate to be a new heat-dissipating substrate base material.

Inventors:
TANG GUOFANG (CN)
YE SUWEN (CN)
SUN PENG (CN)
Application Number:
PCT/CN2015/080533
Publication Date:
June 30, 2016
Filing Date:
June 01, 2015
Export Citation:
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Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L83/04; C08K3/10; C08K3/22; C08K3/36; H01L23/29
Foreign References:
US20060270786A12006-11-30
CN101381515A2009-03-11
CN101712799A2010-05-26
CN101870817A2010-10-27
JP2013107984A2013-06-06
CN101565600A2009-10-28
CN102181264A2011-09-14
Other References:
See also references of EP 3239245A4
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
北京品源专利代理有限公司 (CN)
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