Title:
PACKAGING ARTICLE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2024/101423
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a packaging article including an adhesive body which, even when having no release liner, does not have a decrease in adhesive force after having been stored and transported as a wound body; and a method for manufacturing the same. The present invention relates to a packaging article comprising a wound adhesive body including an adhesive layer as an outermost layer and a packaging material, wherein the wound body is accommodated in the packaging material, and an end of the packaging material is folded into the inside of the wound body. The present invention also relates to a method for manufacturing a packaging article including a wound adhesive body including an adhesive layer as an outermost layer and a packaging material, the wound body being accommodated in the packaging material, the method comprising a step for folding an end of the packaging material into the inside of the wound body.
Inventors:
SHIMOKAWA KAYO (JP)
MORISHITA HIROMITSU (JP)
TSUKAMOTO NARUMI (JP)
MORISHITA HIROMITSU (JP)
TSUKAMOTO NARUMI (JP)
Application Number:
PCT/JP2023/040414
Publication Date:
May 16, 2024
Filing Date:
November 09, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B65D85/67; B65D85/04; C09J7/22; C09J7/38; C09J201/10
Attorney, Agent or Firm:
EIKOH, P.C. (JP)
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