Title:
PACKAGING METHOD FOR OLED SUBSTRATE AND OLED PACKAGING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/161628
Kind Code:
A1
Abstract:
A packaging method for an OLED substrate (20) and an OLED packaging structure. In the packaging method for the OLED substrate (20), a passivation layer is manufactured in two layers in the process of manufacturing the OLED substrate (20), a first layer is a conventional silicon oxide layer (71), and the second layer is a silicon oxynitride layer (72); and the silicon oxynitride layer (72) is in direct contact with a sealant (40) in the packaging process. The adhesivity of the sealant (40) and a silicon oxynitride material is relatively high, so that the adhesivity of the sealant (40) and the OLED substrate (20) is improved, thereby achieving the effect of improving the packaging efficiency of the sealant (40). According to the OLED packaging structure, a surface layer of a packaging region of the OLED substrate (20) is set to be the silicon oxynitride layer (72); and by means of the characteristic of relatively high adhesivity of the sealant (40) and the silicon oxynitride material, the adhesivity of the sealant (40) and the OLED substrate (20) is improved, thereby achieving the effect of improving the packaging efficiency of the sealant (40).
Inventors:
ZENG WEIJING (CN)
HSU YUANJUN (CN)
HSU YUANJUN (CN)
Application Number:
PCT/CN2016/080280
Publication Date:
September 28, 2017
Filing Date:
April 26, 2016
Export Citation:
Assignee:
SHENZHEN CHINA STAR OPTOELECT (CN)
International Classes:
H01L51/56; H01L51/52
Foreign References:
| CN102867839A | 2013-01-09 | |||
| CN104538405A | 2015-04-22 |
Attorney, Agent or Firm:
COMIPS INTELLECTUAL PROPERTY OFFICE (CN)
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