Title:
PACKAGING MICROELECTROMECHANICAL STRUCTURES
Document Type and Number:
WIPO Patent Application WO2003083883
Kind Code:
A3
Abstract:
A MEMS device (14) may be formed in a hermetic cavity (42) by sealing a pair of semiconductor structures (22, 32) to one another, enclosing the MEMS device (12). The two structures (22, 32) may be coupled using surface mount techniques as one example, so that the temperatures utilized may be compatible with many MEMS applications. Electrical interconnection layers (40) in one or the other of these structures may be utilized to allow electrical interconnections from the exterior world to the MEMS components (14) within the cavity (42).
Inventors:
MA QING
BERRY MICHELE
WONG DANIEL
RAO VALLURI
HECK JOHN
BERRY MICHELE
WONG DANIEL
RAO VALLURI
HECK JOHN
Application Number:
PCT/US2003/003798
Publication Date:
December 11, 2003
Filing Date:
February 07, 2003
Export Citation:
Assignee:
INTEL CORP (US)
International Classes:
B81B7/00; H01L23/10; (IPC1-7): B81B7/00
Domestic Patent References:
| WO1998006118A1 | 1998-02-12 |
Foreign References:
| US6219254B1 | 2001-04-17 | |||
| US5610431A | 1997-03-11 | |||
| US20020000646A1 | 2002-01-03 |
Other References:
TILMANS H A C ET AL: "THE INDENT REFLOW SEALING (IRS) TECHNIQUE-A METHOD FOR THE FABRICATION OF SEALED CAVITIES FOR MEMS DEVICES", JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, IEEE INC. NEW YORK, US, vol. 9, no. 2, 1 June 2000 (2000-06-01), pages 206 - 217, XP001011624, ISSN: 1057-7157
RENARD S: "WAFER LEVEL SURFACE MOUNTABLE CHIP SIZE PACKAGING FOR MEMS AND ICS", PROCEEDINGS OF THE SPIE, SPIE, BELLINGHAM, VA, US, VOL. 4176, 18-19 SEPT. 2000, PAGE(S) 236-291, ISSN: 0277-786X, XP008008637
NEYSMITH J ET AL: "A modular, direct-chip-attach MEMS package: architecture and processing", PROCEEDINGS 2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS (SPIE VOL.4339), 2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, BOSTON, MA, USA, 18-20 SEPT. 2000, 2000, RESTON, VA, USA, IMAPS - INT. MICROELECTRON. & PACKAGING SOC, USA, PAGE(S) 569 - 573, ISBN: 0-930815-62-9, XP009020037
RENARD S: "WAFER LEVEL SURFACE MOUNTABLE CHIP SIZE PACKAGING FOR MEMS AND ICS", PROCEEDINGS OF THE SPIE, SPIE, BELLINGHAM, VA, US, VOL. 4176, 18-19 SEPT. 2000, PAGE(S) 236-291, ISSN: 0277-786X, XP008008637
NEYSMITH J ET AL: "A modular, direct-chip-attach MEMS package: architecture and processing", PROCEEDINGS 2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS (SPIE VOL.4339), 2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, BOSTON, MA, USA, 18-20 SEPT. 2000, 2000, RESTON, VA, USA, IMAPS - INT. MICROELECTRON. & PACKAGING SOC, USA, PAGE(S) 569 - 573, ISBN: 0-930815-62-9, XP009020037
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