Title:
PCB ASSEMBLY COMPRISING THERMAL MODULE
Document Type and Number:
WIPO Patent Application WO/2024/063341
Kind Code:
A1
Abstract:
A PCB assembly according to one embodiment comprises: a first circuit board; an electronic component provided on the first circuit board; a second circuit board connected to the first circuit board; a thermal module configured to absorb heat from the electronic component; and a pressurizing structure configured to apply a pre-load to the thermal module in a direction toward the electronic component, wherein the pressurizing structure may be supported on the first circuit board or an external structure, while separated from the second circuit board.
Inventors:
CHUNG HAEIN (KR)
KANG JUNGHAN (KR)
RHEE BONGJAE (KR)
LIM JONGHYUN (KR)
KANG JUNGHAN (KR)
RHEE BONGJAE (KR)
LIM JONGHYUN (KR)
Application Number:
PCT/KR2023/012148
Publication Date:
March 28, 2024
Filing Date:
August 17, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K1/02; H05K1/14; H05K7/20; H05K9/00
Foreign References:
| KR19980063404A | 1998-10-07 | |||
| JP2007200940A | 2007-08-09 | |||
| KR20190053589A | 2019-05-20 | |||
| CN217363378U | 2022-09-02 | |||
| US20040047130A1 | 2004-03-11 |
Attorney, Agent or Firm:
MUHANN PATENT & LAW FIRM (KR)
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