PHOTOCURABLE EPOXY ADHESIVE AGENT, RESIN COMPOSITION, LAMINATE , DISPLAY, AND METHOD FOR PRODUCING RESIN COMPOSITION

WIPO Patent Application WO/2014/163090

A1

According to the present invention, a photocurable epoxy adhesive agent can be produced, which has an excellent polymerization conversion rate at a lower temperature, also has excellent adhesion strength and water vapor permeation resistance, and enables the production of a cured article having good productivity. The photocurable epoxy adhesive agent according to the present invention comprises: (A) an epoxy monomer or oligomer; (B) a photo-cationic polymerization initiator; and (C) a layered silicate. The adhesive agent is photocurable and therefore can be cured at a lower temperature, and exhibits excellent adhesion strength. The adhesive agent can be cured within a short time and therefore has excellent productivity. A resin composition produced after the curing of the photocurable epoxy adhesive agent has high water vapor permeation resistance.

WO/2014/173112	SEALANT, SEALING METHOD THEREOF, DISPLAY PANEL, AND DISPLAY APPARATUS SEALED USING THE SEALANT
WO/2012/053589	ADHESIVE COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
JP2002309220	TREATING LIQUID FOR ADHERING RUBBER TO FIBER AND TREATING METHOD OF RUBBER-REINFORCING FIBER

MITANI MAKOTO (JP)
FUJITA ATSUKO (JP)

PCT/JP2014/059664

October 09, 2014

April 01, 2014

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JNC CORP (JP)

C09J163/00; B32B27/18; B32B27/38; C09J11/04; C09J11/06; G02F1/1339

WO2010095692A1	2010-08-26
WO2010084939A1	2010-07-29

JP2006291072A	2006-10-26
JP2011225773A	2011-11-10
JP2004231938A	2004-08-19
JP2008534771A	2008-08-28
JP2003327785A	2003-11-19
JPH0673159A	1994-03-15
JP2004155799A	2004-06-03
JP2006152044A	2006-06-15

MIYAGAWA, Teiji et al. (JP)
Teiji Miyagawa (JP)

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