PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, MEMBER FOR TOUCH PANEL, AND METHOD FOR MANUFACTURING CURED FILM

Title:

PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, MEMBER FOR TOUCH PANEL, AND METHOD FOR MANUFACTURING CURED FILM

Document Type and Number:

WIPO Patent Application WO/2017/110689

Kind Code:

A1

Abstract:

The purpose of the present invention is to provide a photosensitive resin composition that has excellent pattern processability and that is endowed with sufficient resistance to chemicals and adhesion to substrates even by low-temperature curing at 150℃ or below. The present invention is a photosensitive resin composition containing (A) an unsaturated ethylene group- and carboxyl group-containing photoreactive resin, (B) an epoxy compound, (C) a polyfunctional epoxy compound, and (D) a photoinitiator.

More Like This:

JP4396300	Photosensitive resin composition and its manufacturing method, screen printing plate, and electronic component manufacturing method
JPWO2017030099	Composite materials, photosensitive resin compositions for solder resists, and photosensitive elements
JP4595374	Black photosensitive resin composition

Inventors:

KOSHINO MIKA (JP)
NAKAMICHI MIKI (JP)
SUWA MITSUHITO (JP)

Application Number:

PCT/JP2016/087622

Publication Date:

June 29, 2017

Filing Date:

December 16, 2016

Export Citation:

Click for automatic bibliography generation Help

Assignee:

TORAY INDUSTRIES (JP)

International Classes:

G03F7/027; C08F2/46; C08G59/32; G02F1/1333; G03F7/004; G03F7/038; G03F7/085; G06F3/041

Domestic Patent References:

WO2015029261A1

2015-03-05

Foreign References:

JP2010223992A	2010-10-07
JP2003233166A	2003-08-22
JP2013076821A	2013-04-25
JP2014232324A	2014-12-11

Download PDF:

View/Download PDF PDF Help

Previous Patent: MOTOR

Next Patent: GAS DIFFUSION ELECTRODE