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Title:
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED FILM, CURED FILM, LIQUID CRYSTAL DISPLAY DEVICE, ORGANIC ELECTROLUMINESCENCE DISPLAY DEVICE, AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2016/035819
Kind Code:
A1
Abstract:
Provided are: a photosensitive resin composition having exceptional chemical resistance, light resistance, and solvent solubility; a method for manufacturing a cured film; a cured film; a liquid crystal display device; an organic electroluminescence display device; and a touch panel. The photosensitive resin composition contains a polybenzoxazole precursor, quinonediazide compound or a light acid generator for generating an acid having a pKa of 3 or less, and a solvent. The polybenzoxazole precursor contains a total of at least 70 mol% of repeating units represented by general formula (1) and general formula (2) in relation to all repeating units, the ratio between the repeating units represented by general formula (1) and the repeating units represented by general formula (2) being 9:1-3:7 in molar ratio. Y1 represents a C3-15 cyclic aliphatic group and Y2 represents a C4-20 straight-chain or branched aliphatic group.

Inventors:
YOSHIDA KENTA (JP)
AMEMIYA TAKUMA (JP)
YAMADA SATORU (JP)
NAKAGAWA MIKIO (JP)
Application Number:
PCT/JP2015/074955
Publication Date:
March 10, 2016
Filing Date:
September 02, 2015
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/039; C08G73/22; G02F1/1333; G03F7/004; G03F7/023; G06F3/041; H01L51/50; H05B33/10; H05B33/12; H05B33/22
Domestic Patent References:
WO2010001780A12010-01-07
Foreign References:
JP2013041300A2013-02-28
JP2013167742A2013-08-29
JP2010044143A2010-02-25
JPH05125184A1993-05-21
JPS5174704A1976-06-28
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
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