PHOTOSENSITIVE RESIN COMPOSITION

WIPO Patent Application WO/2015/137281

A1

　The present invention provides a positive photosensitive resin composition capable of improving uniformity of film thickness within a substrate surface when applied by spin-coating. The invention is characterized in containing: (a) at least one type of resin selected from a resin principally comprising the structure represented in general formula (1), a polyimide, a polybenzoxazole, and a phenolic resin; (b) a quinonediazide compound; (c) a surfactant; and (d) an organic solvent, the organic solvent (d) containing at least an organic solvent having an atmospheric-pressure boiling point d-1 of from 150°C to less than 180°C, and an organic solvent having an atmospheric-pressure boiling point d-2 of from 180°C to less than 220°C. (In general formula (1), R1 and R2 may be the same or different, and each represents an di- to octa-valent organic group having two or more carbons. R3 and R4 may be the same or different, and each represents a hydrogen or a C1-20 organic group. n is a range of 10 to 100,000, m and f each independently represents an integer of 0 to 2, and p and q each independently represents an integer of 0 to 4. m+q≠0 and p+q≠0.)

IKEDA YOSHIFUMI (JP)
FUJITA YOJI (JP)

PCT/JP2015/056844

September 17, 2015

March 09, 2015

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TORAY INDUSTRIES (JP)

G03F7/004; G03F7/023; G03F7/075

JP2013232314A	2013-11-14
JP2007114763A	2007-05-10
JP2014162818A	2014-09-08
JP2008107529A	2008-05-08
JP2005292276A	2005-10-20

Seiryu Patent Professional Corporation et al. (JP)
Clear stream international patent business corporation (JP)

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