Title:
PLASMA PROCESSING SYSTEM AND PLASMA TREATMENT PROCESS
Document Type and Number:
WIPO Patent Application WO2005045873
Kind Code:
A3
Abstract:
A plasma treatment system (10) for treating multiple substrates (26) with a plasma. The treatment chamber (12) of the plasma treatment system includes at least one pair of electrodes (24), typically vertically oriented, between which a substrate (26) is positioned for plasma treatment. Each electrode (24) includes a perforated panel (42, 50) that permits horizontal process gas and plasma flow, which improves plasma uniformity. A process recipe is defined that is effective for removing thin polymer areas, such as flash or chad, attached to and projecting from a polymer substrate (26).
Inventors:
GETTY JAMES (US)
FIERRO LOUIS (US)
FIERRO LOUIS (US)
Application Number:
PCT/US2004/032973
Publication Date:
February 16, 2006
Filing Date:
October 06, 2004
Export Citation:
Assignee:
NORDSON CORP (US)
GETTY JAMES (US)
FIERRO LOUIS (US)
GETTY JAMES (US)
FIERRO LOUIS (US)
International Classes:
H01J37/32; H05H1/24; (IPC1-7): H01J37/32; H05H1/24
Foreign References:
| US4474659A | 1984-10-02 | |||
| US4282077A | 1981-08-04 | |||
| US20030184234A1 | 2003-10-02 | |||
| EP0359567A2 | 1990-03-21 | |||
| DD156715A1 | 1982-09-15 | |||
| US4223048A | 1980-09-16 | |||
| US20010029892A1 | 2001-10-18 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 009, no. 280 (E - 356) 8 November 1985 (1985-11-08)
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 12 25 December 1997 (1997-12-25)
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 12 25 December 1997 (1997-12-25)
Download PDF:
Previous Patent: FIELD EMISSION DEVICE WITH COATING LAYER AND METHOD FOR FABRICATING THE SAME
Next Patent: ION SOURCE CONTROL SYSTEM
Next Patent: ION SOURCE CONTROL SYSTEM