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Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/187969
Kind Code:
A1
Abstract:
Provided is a polishing composition that, although including a polyvinyl alcohol-based polymer, has suppressed aggregation of the polyvinyl alcohol-based polymer in the composition and can effectively reduce surface defects. This polishing composition includes abrasive grains and water. The polishing composition also includes the polyvinyl alcohol-based polymer and a dispersant for the polyvinyl alcohol-based polymer. The dispersant includes an ether bond in the molecules thereof. The molar ratio of the polyvinyl alcohol-based polymer content relative to the dispersant content is 0.01–10.

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Inventors:
TSUCHIYA KOHSUKE (JP)
ASADA MAKI (JP)
ICHITSUBO TAIKI (JP)
Application Number:
PCT/JP2019/008022
Publication Date:
October 03, 2019
Filing Date:
March 01, 2019
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Domestic Patent References:
WO2018043504A12018-03-08
WO2017150158A12017-09-08
WO2015046164A12015-04-02
WO2018025655A12018-02-08
WO2014129408A12014-08-28
WO2013176122A12013-11-28
WO2017150118A12017-09-08
WO2018096991A12018-05-31
Foreign References:
JP2016056220A2016-04-21
Attorney, Agent or Firm:
ABE, Makoto (JP)
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