Title:
POLYAMIC ACID ESTER RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/080206
Kind Code:
A1
Abstract:
The present invention provides: a photosensitive resin composition which enables the achievement of a cured product having low dielectric constant and low dielectric loss tangent; a method for producing a substrate with a cured relief pattern using this photosensitive resin composition; and a semiconductor device which is provided with this cured relief pattern. A polyamic acid ester resin composition which contains (A) a polyimide precursor that has a unit structure represented by general formula (1) (wherein X1 represents a tetravalent organic group; Y1 represents a divalent organic group; and each of R1 and R2 independently represents a monovalent organic group), and (B) a carboxylic acid compound represented by general formula (30) (wherein each of Z1 and Z2 independently represents a hydrogen atom, an alkyl group or the like, and Z1 and Z2 may combine with each other to form a ring; in cases where the ring is an aromatic ring, indicates a conjugated double bond that has HOOC at the ortho position of COOH; and in cases other than the cases where the ring is an aromatic ring, indicates a cis-type double bond with respect to HOOC and COOH) or an anhydride of the carboxylic acid compound, while optionally containing (P) a polymer compound other than the polyimide precursor (A). With respect to this polyamic acid ester resin composition, the carboxylic acid compound or an anhydride thereof (B) may be chemically bonded to the polyimide precursor (A) and/or the polymer compound (P) other than the polyimide precursor (A) via Z1 or Z2.
Inventors:
USUI YUKI (JP)
OHASHI TAKUYA (JP)
HATTORI HAYATO (JP)
SAWADA KAZUHIRO (JP)
ENDO MASAHISA (JP)
SAKAGUCHI TAKAHIRO (JP)
HIRASADA KAZUKI (JP)
OHASHI TAKUYA (JP)
HATTORI HAYATO (JP)
SAWADA KAZUHIRO (JP)
ENDO MASAHISA (JP)
SAKAGUCHI TAKAHIRO (JP)
HIRASADA KAZUKI (JP)
Application Number:
PCT/JP2019/039733
Publication Date:
April 23, 2020
Filing Date:
October 09, 2019
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
C08L79/08; C08G73/10; C08K5/12; G03F7/004; G03F7/027; G03F7/20
Domestic Patent References:
| WO2015159911A1 | 2015-10-22 |
Foreign References:
| JP2016021068A | 2016-02-04 | |||
| JPH09184912A | 1997-07-15 | |||
| JPH0920865A | 1997-01-21 | |||
| JP2008107766A | 2008-05-08 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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