Title:
POLYIMIDE RESIN COMPOSITION AND METAL-BASED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/181291
Kind Code:
A1
Abstract:
A polyimide resin composition comprising a polyimide resin and a filler dispersed in the polyimide resin, said polyimide resin composition being characterized in that the polyimide resin has a dicarboxylic acid group or a dicarboxylic acid anhydride group at each end thereof, and the filler has at least one inorganic compound selected from the group consisting of aluminum oxide, aluminum hydroxide, magnesium oxide, and magnesium hydroxide on the surface thereof.
Inventors:
HARA SHINTARO (JP)
ISHIKAWA FUMIAKI (JP)
SUSUKI KYOKA (JP)
ISHIKAWA FUMIAKI (JP)
SUSUKI KYOKA (JP)
Application Number:
PCT/JP2022/004379
Publication Date:
September 01, 2022
Filing Date:
February 04, 2022
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C08G73/10; C08K9/02; C08L79/08; H05K1/05
Domestic Patent References:
| WO2013108890A1 | 2013-07-25 |
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Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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