Title:
POLYPROPYLENE RESIN COMPOSITION FOR THIN WALL INJECTION MOLDING, MOLDED ARTICLE AND CONTAINER
Document Type and Number:
WIPO Patent Application WO/2012/067231
Kind Code:
A1
Abstract:
This polypropylene resin composition for thin wall injection molding comprises a propylene resin material and a clarifying nucleating agent, the limiting viscosity of xylene solubles being 0.9-1.3 dl/g, and the melt flow rate measured under conditions of a temperature of 230°C and a load of 21.6 N being 30-70 g/10 mins. In addition, the propylene resin material is an ethylene propylene copolymer with an ethylene unit of 1.2 mass% or less that is polymerized or an ethylene 1-butene copolymer with an ethylene unit of 74-86 mass% polymerized under the presence of homopolypropylene. Further, the ethylene 1-butene copolymer content is 22-32 mass% when the polypropylene resin composition for thin wall injection molding is 100 mass%. According to the present invention, a polypropylene resin composition for thin wall injection molding which has excellent blush resistance, low temperature impact strength and thin wall moldability can be provided.
Inventors:
NAKAJIMA TAKESHI (JP)
KANNO SHITOSHI (JP)
TSURUMI NOBUYUKI (JP)
KANNO SHITOSHI (JP)
TSURUMI NOBUYUKI (JP)
Application Number:
PCT/JP2011/076671
Publication Date:
May 24, 2012
Filing Date:
November 18, 2011
Export Citation:
Assignee:
SUNALLOMER LTD (JP)
NAKAJIMA TAKESHI (JP)
KANNO SHITOSHI (JP)
TSURUMI NOBUYUKI (JP)
NAKAJIMA TAKESHI (JP)
KANNO SHITOSHI (JP)
TSURUMI NOBUYUKI (JP)
International Classes:
C08L51/06; B29C45/00; B65D1/00; C08F255/04; C08K3/22; C08K5/053; C08K5/098; C08K5/521
Domestic Patent References:
| WO1995027741A1 | 1995-10-19 |
Foreign References:
| JP2005068239A | 2005-03-17 | |||
| JP2004217896A | 2004-08-05 | |||
| JPH11302471A | 1999-11-02 | |||
| JPH0625367A | 1994-02-01 | |||
| JP2005187713A | 2005-07-14 |
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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Claims: