POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND POLYHYDROXYAMIDE RESIN

Title:

POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND POLYHYDROXYAMIDE RESIN

Document Type and Number:

WIPO Patent Application WO/2010/005028

Kind Code:

A1

Abstract:

Disclosed is a positive photosensitive resin composition having excellent electrical insulation properties, heat resistance, mechanical strength and electrical characteristics, which is capable of forming a high-resolution circuit pattern. The positive photosensitive resin is characterized by containing at least one kind of polyhydroxyamide resin (A) containing a repeating unit represented by formula (1) and having a weight average molecular weight of 3,000-20,000, and a compound (B) which generates an acid by the action of light. (In the formula, X represents a tetravalent aliphatic group or aromatic group; R1 and R2 independently represent a hydrogen atom or an alkyl group having 1-10 carbon atoms; Ar1 and Ar2 independently represent an aromatic group; Y represents an organic group containing at least one aromatic group substituted by a carboxyl group; n represents an integer of not less than 1; and l and m independently represent 0 or an integer of not less than 1 and satisfy l + m ≥ 2.)

Inventors:

EBARA KAZUYA (JP)
SUZUKI HIDEO (JP)
TAMURA TAKAYUKI (JP)

Application Number:

PCT/JP2009/062452

Publication Date:

January 14, 2010

Filing Date:

July 08, 2009

Export Citation:

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Assignee:

NISSAN CHEMICAL IND LTD (JP)
EBARA KAZUYA (JP)
SUZUKI HIDEO (JP)
TAMURA TAKAYUKI (JP)

International Classes:

G03F7/023; C08G69/26; G03F7/004; G03F7/075

Domestic Patent References:

WO2008149730A1

2008-12-11

Foreign References:

JP2000230049A	2000-08-22
JP2002341527A	2002-11-27
JPS5855926A	1983-04-02
JP2005139302A	2005-06-02