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Patent Searching and Data


Title:
POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/177250
Kind Code:
A1
Abstract:
The present invention relates to a positive-type photosensitive resin composition containing an alkali-soluble resin (A), a photosensitizer (B), a crosslinking agent (C), and a surfactant (D), wherein the crosslinking agent (C) includes a compound having one or more acidic moieties selected from the group consisting of the carboxyl moiety, the phenolic hydroxy moiety, the sulfo moiety and the phosphate moiety; the proportion of the compound having the acidic moiety relative to the total amount of (A)+(B)+(C)+(D) is in the range of 5-35% by mass; and the surfactant (D) does not contain a F atom.

Inventors:
KAWASHIMA MASAYUKI (JP)
TAKAHASHI HIDEYUKI (JP)
Application Number:
PCT/JP2021/007782
Publication Date:
September 10, 2021
Filing Date:
March 01, 2021
Export Citation:
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Assignee:
AGC INC (JP)
International Classes:
G03F7/004; G02B5/20; G03F7/023; H01L51/50; H05B33/12; H05B33/22
Foreign References:
JP2010134422A2010-06-17
JP2012252095A2012-12-20
JP2016166951A2016-09-15
JP2016042126A2016-03-31
JPH06118648A1994-04-28
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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