POWDER MATERIAL FOR USE IN POWDER LAMINATE MOLDING, POWDER LAMINATE MOLDING METHOD USING SAME, AND MOLDED ARTICLE

Title:

POWDER MATERIAL FOR USE IN POWDER LAMINATE MOLDING, POWDER LAMINATE MOLDING METHOD USING SAME, AND MOLDED ARTICLE

Document Type and Number:

WIPO Patent Application WO/2020/100542

Kind Code:

A1

Abstract:

Provided is a powder material that is for producing a molded article that has low porosity but has uniformly distributed micropores by means of a powder laminate molding method. A powder material that is to be used for powder laminate molding, the powder material including ceramic and metal, and the tapped fill rate of the powder material, defined as (tapped density/theoretical density)×100%, being at least 30% but less than 40%.

Inventors:

YAMADA JUNYA (JP)
IBE HIROYUKI (JP)
KATO NOBUAKI (JP)
KATO YUTA (JP)
SUGIYAMA YOSHIKAZU (JP)

Application Number:

PCT/JP2019/041567

Publication Date:

May 22, 2020

Filing Date:

October 23, 2019

Export Citation:

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Assignee:

FUJIMI INC (JP)

International Classes:

B22F1/05; B22F1/052; B22F3/105; B22F3/16; B33Y70/00; C04B35/626; C22C1/05; C22C29/08; B22F1/10; B22F1/148

Domestic Patent References:

WO2017117527A1	2017-07-06
WO2015194678A1	2015-12-23

Foreign References:

JP2017115194A	2017-06-29
JP2018154905A	2018-10-04
JP2018090841A	2018-06-14
JP2015205512A	2015-11-19
JP2003245981A	2003-09-02
JP2017113952A	2017-06-29
JP2017114716A	2017-06-29

Other References: