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Title:
POWER CONVERSION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/276267
Kind Code:
A1
Abstract:
This power conversion device comprises: a plurality of circuit bodies each having a semiconductor element; and a printed substrate on which the plurality of circuit bodies are mounted, and which includes AC wiring, DC wiring, and relay wiring that connects the plurality of circuit bodies to each other. At least one of the AC wiring and the DC wiring is connected to a conductive member.

Inventors:
TOKUYAMA TAKESHI (JP)
ARAKI TAKAHIRO (JP)
AOYAGI SHIGEHISA (JP)
MAEKAWA NORIYUKI (JP)
Application Number:
PCT/JP2022/008092
Publication Date:
January 05, 2023
Filing Date:
February 25, 2022
Export Citation:
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Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
H02M7/48; H05K1/02
Domestic Patent References:
WO2010119514A12010-10-21
Foreign References:
JP2020061831A2020-04-16
JP2010193714A2010-09-02
JP2011142162A2011-07-21
JP2004072959A2004-03-04
Attorney, Agent or Firm:
SUNNEXT INTERNATIONAL PATENT OFFICE (JP)
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