Title:
POWER MODULE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2021/162369
Kind Code:
A1
Abstract:
The present invention relates to a power module and a method for manufacturing same, in which an insulating spacer is disposed between two upper and lower substrates to thus efficiently dissipate the heat generated from a semiconductor chip mounted between the substrates, and prevent bending deformation due to heat. In addition, since the spacer made of an insulating material is integrated with the substrates by brazing bonding, the bonding strength is improved, thereby maintaining strong bonding even against vibration, etc.
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Inventors:
LEE JIHYUNG (KR)
Application Number:
PCT/KR2021/001600
Publication Date:
August 19, 2021
Filing Date:
February 08, 2021
Export Citation:
Assignee:
AMOGREENTECH CO LTD (KR)
International Classes:
H01L23/00; H01L21/324; H01L23/14; H01L23/15; H01L23/34; H02M7/00; H02M7/44
Domestic Patent References:
| WO2019022133A1 | 2019-01-31 |
Foreign References:
| KR20180038597A | 2018-04-17 | |||
| KR101734712B1 | 2017-05-11 | |||
| KR0147961B1 | 1998-08-01 | |||
| KR20170068271A | 2017-06-19 | |||
| KR20160126923A | 2016-11-02 |
Attorney, Agent or Firm:
KIM, Churchill (KR)
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