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Patent Searching and Data


Title:
PRESS-FIT TERMINAL, PRESS-FIT TERMINAL MANUFACTURING METHOD AND STRUCTURE FOR CONNECTING PRESS-FIT TERMINAL AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2006/077827
Kind Code:
A1
Abstract:
A press-fit terminal which prevents a plated surface from being ground even when the terminal is press-fit in a through hole of a circuit board and has a high connection reliability. A method for manufacturing a press-fit terminal to be inserted into the conductive through hole of the circuit board is provided with a base plating step wherein one or a plurality of base plating layers are formed on a terminal base material surface of a press-fit connecting section which is brought into electrical contact with the through hole; an Sn plating step wherein an Sn plating layer is formed on the uppermost base plating layer; and a reflow step wherein heat treatment is performed after forming the Sn plating layer, an alloy layer of Sn and a base plating metal of the uppermost layer is formed on the uppermost base plating layer, and unalloyed Sn is mixed in an uppermost layer of the alloy layer.

Inventors:
SAITOH YASUSHI (JP)
Application Number:
PCT/JP2006/300526
Publication Date:
July 27, 2006
Filing Date:
January 17, 2006
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SAITOH YASUSHI (JP)
International Classes:
H01R12/04; H01R12/55; H01R12/58; H01R13/03; H01R43/16
Foreign References:
JP2004111172A2004-04-08
JPH04235292A1992-08-24
JPH10302867A1998-11-13
JPH11135226A1999-05-21
JPH083762A1996-01-09
Attorney, Agent or Firm:
Ueno, Noboru (21-23 Sakae 3-chome, Naka-k, Nagoya-shi Aichi 08, JP)
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