PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE, AND PRESSURE-SENSITIVE ADHESIVE SHEET

Title:

PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE, AND PRESSURE-SENSITIVE ADHESIVE SHEET

Document Type and Number:

WIPO Patent Application WO/2021/193724

Kind Code:

A1

Abstract:

Provided is a pressure-sensitive adhesive composition for forming a pressure-sensitive adhesive including an acrylic polymer. The acrylic polymer is constituted from monomer ingredients comprising an aromatic-ring-containing monomer (A1) and a monomer (A2) having a hydroxyl group and/or a carboxy group. In the monomer ingredients, the content of the aromatic-ring-containing monomer (A1) is 75-99 wt% and the content of the monomer (A2) having a hydroxyl group and/or a carboxy group is 1-25 wt%.

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Inventors:

YAMAMOTO YUSUKE (JP)
KATAOKA KENICHI (JP)
KATAMI HIROFUMI (JP)
NISHINO TOMOYA (JP)
NOYORI SHINTARO (JP)

Application Number:

PCT/JP2021/012261

Publication Date:

September 30, 2021

Filing Date:

March 24, 2021

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Assignee:

NITTO DENKO CORP (JP)

International Classes:

C09J11/06; C09J7/38; C09J133/00; C09J133/04; C09J133/14

Domestic Patent References:

WO2017014089A1	2017-01-26
WO2010098182A1	2010-09-02

Foreign References:

JP2015081288A	2015-04-27
JP2012167187A	2012-09-06
JP2011153169A	2011-08-11
JP2019532163A	2019-11-07
JP2014169382A	2014-09-18

Attorney, Agent or Firm:

OI, Michiko (JP)

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