Title:
PRIMER COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2013/178506
Kind Code:
A3
Abstract:
Disclosed herein are primer compositions for priming a substrate for application of a curable composition. The primer composition may comprise: (a) a carrier component having a molecular weight in the range of 30 to 300, and a melting point in the range of 30 to 500 °C; and (b) a primer component for the curable composition which is dispersible in the carrier component when the carrier component is in a melted or liquid state. The primer composition can be applied to the substrate in liquid form and subsequently cooled to solidify thereon.
Inventors:
BIRKETT DAVID P (IE)
MULLEN DAVID (IE)
WYER MARTIN (CA)
MULLEN DAVID (IE)
WYER MARTIN (CA)
Application Number:
PCT/EP2013/060415
Publication Date:
July 17, 2014
Filing Date:
May 21, 2013
Export Citation:
Assignee:
HENKEL IRELAND LTD (DE)
International Classes:
C09J5/02
Domestic Patent References:
| WO2003095535A1 | 2003-11-20 | |||
| WO2002014399A1 | 2002-02-21 |
Attorney, Agent or Firm:
LANE, Cathal Michael et al. (5 Dartmouth RoadDublin, 6, IE)
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