Title:
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME 인쇄회로기판 및 그의 제조 방법
Document Type and Number:
WIPO Patent Application WO/2012/087073
Kind Code:
A2
Abstract:
A printed circuit board, according to one embodiment of the present invention, comprises: an insulation layer; a pad, which is formed on the insulation layer, and is exposed through an open portion of a solder resist; and a bump, which is from the top of the pad so as to burry the open portion of the solder resist and has a width that is smaller than the width of the open portion of th solder resist. 본 발명의 실시 예에 따른 인쇄회로기판은 절연층; 상기 절연층 위에 형성되며, 솔더 레지스트의 개구부를 통해 노출되는 패드; 및, 상기 패드 위로부터 상기 솔더 레지스트의 개구부를 매립하며 형성되고, 상기 솔더 레지스트의 개구부의 폭보다 작은 폭을 갖는 범프를 포함한다.
Inventors:
RYU SUNG WUK (KR)
SHIM SEONG BO (KR)
SHIN SEUNG YUL (KR)
SHIM SEONG BO (KR)
SHIN SEUNG YUL (KR)
Application Number:
PCT/KR2011/010058
Publication Date:
June 28, 2012
Filing Date:
December 23, 2011
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
RYU SUNG WUK (KR)
SHIM SEONG BO (KR)
SHIN SEUNG YUL (KR)
RYU SUNG WUK (KR)
SHIM SEONG BO (KR)
SHIN SEUNG YUL (KR)
International Classes:
H05K3/40; H05K3/34
Foreign References:
| KR20090099288A | 2009-09-22 | |||
| KR20100012370A | 2010-02-08 | |||
| KR20090021076A | 2009-02-27 | |||
| JP2007214534A | 2007-08-23 | |||
| JP2012054295A | 2012-03-15 |
Other References:
None
See also references of EP 2645828A4
See also references of EP 2645828A4
Attorney, Agent or Firm:
SEO, Kyo Jun (KR)
서교준 (KR)
서교준 (KR)
Download PDF:
Claims:
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