Title:
PRINTED CIRCUIT BOARD MODULE AND ELECTRONIC APPARATUS COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2023/055066
Kind Code:
A1
Abstract:
Various embodiments of the present disclosure relate to a printed circuit board module and an electronic apparatus comprising same. According to various embodiments of the present disclosure, provided is a printed circuit board module comprising: a board including a first surface facing a first direction and having formed thereon a first pad for electrical connection with the board, and a second surface facing a second direction opposite to the first direction and having formed thereon the first pad for electrical connection with the board and a second pad for bonding a shielding member; and at least one component disposed on the second surface, wherein the printed circuit board module may be bonded to an adjacent board by using the first pad formed on the first surface or the second surface. Various other embodiments may be applied.
Inventors:
JEON JINHWAN (KR)
Application Number:
PCT/KR2022/014546
Publication Date:
April 06, 2023
Filing Date:
September 28, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K1/14; H04M1/02; H05K1/11; H05K9/00
Foreign References:
| KR20210014389A | 2021-02-09 | |||
| KR20210078239A | 2021-06-28 | |||
| KR20190100638A | 2019-08-29 | |||
| US20110296678A1 | 2011-12-08 | |||
| US20100319981A1 | 2010-12-23 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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