Title:
PROCESS FOR MANUFACTURING CIRCUIT BOARD AND CIRCUIT BOARD OBTAINED BY THE PROCESS
Document Type and Number:
WIPO Patent Application WO/2007/114123
Kind Code:
A1
Abstract:
A process for manufacturing a circuit board having a circuit chip embedded resin
sheet consisting of a resin sheet embedded with circuit chips, comprising the
steps of (a) arranging and fixing circuit chips on a processing substrate; (b)
applying a liquid energy-hardening resin sheet forming material onto the processing
substrate with the circuit chips arranged and fixed to thereby form an unhardened
coating layer; (c) applying energy to the unhardened coating layer so as to harden
the same, thereby forming a circuit chip embedded resin sheet layer; and (d) detaching
the processing substrate from the circuit chip embedded resin sheet layer.Further,
there is provided a circuit board obtained by the process. Accordingly, a circuit
board having a resin sheet embedded with circuit chips for controlling of each
of pixels for display, etc. can be efficiently produced with high quality at high
productivity.
Inventors:
NAKABAYASHI MASAHITO (JP)
Application Number:
PCT/JP2007/056533
Publication Date:
October 11, 2007
Filing Date:
March 20, 2007
Export Citation:
Assignee:
LINTEC CORP (JP)
NAKABAYASHI MASAHITO (JP)
NAKABAYASHI MASAHITO (JP)
International Classes:
H05K1/18; H05K3/46
Foreign References:
| JP2005135995A | 2005-05-26 | |||
| JP2004319976A | 2004-11-11 |
Attorney, Agent or Firm:
UCHIYAMA, Mitsuru (4-1 Kandasudacho 1-chom, Chiyoda-ku Tokyo 41, JP)
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