Title:
PROCESSING DEVICE AND PROCESSED ARTICLE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/209081
Kind Code:
A1
Abstract:
The present invention reduces the time required for alignment work and comprises: a rotatable cutting table 2A, 2B that holds a sealed substrate W that has an alignment mark AM provided thereupon; a cutting mechanism 4 that cuts the sealed substrate W held on the cutting table 2A, 2B; a reference mark M1 provided on the cutting table 2A, 2B and having a known position relative to the rotation center RC of the cutting table 2A, 2B; and an imaging camera 24 that captures images of the reference mark M1 and the alignment mark AM, wherein the alignment mark AM is imaged while moving the imaging camera 24 in one direction relative to the sealed substrate W, and the sealed substrate W and the cutting mechanism 4 are aligned in the one direction and a direction orthogonal to the one direction on the basis of the imaged alignment mark AM and the reference mark M1.
Inventors:
KATAOKA SHOICHI (JP)
FUKAI MOTOKI (JP)
HORI SATOKO (JP)
SAKAUE YUYA (JP)
SAKAMOTO SHINJI (JP)
YOSHIOKA SHO (JP)
FUKAI MOTOKI (JP)
HORI SATOKO (JP)
SAKAUE YUYA (JP)
SAKAMOTO SHINJI (JP)
YOSHIOKA SHO (JP)
Application Number:
PCT/JP2021/048108
Publication Date:
October 06, 2022
Filing Date:
December 24, 2021
Export Citation:
Assignee:
TOWA CORP (JP)
International Classes:
B24B47/22; B23Q17/24; B24B27/06; B24B41/06; B24B47/04; B24B49/12; H01L21/301; H01L21/68
Foreign References:
| JP2016143861A | 2016-08-08 | |||
| JPH08125400A | 1996-05-17 | |||
| JP2009170501A | 2009-07-30 | |||
| JP2010177691A | 2010-08-12 | |||
| JP2005093710A | 2005-04-07 |
Attorney, Agent or Firm:
NISHIMURA, Ryuhei (JP)
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