Title:
PROCESSING LIQUID, PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/049330
Kind Code:
A1
Abstract:
The present invention provides a processing liquid that, while being excellent in terms of removability of an object to be removed, can suppress etching of a first metal-containing substance that contains one or more types of a first metal selected from the group consisting of Co and Cu, and a processing method. The processing liquid of the present invention is the processing liquid used for processing an object to be processed containing a first metal-containing substance that contains one or more types of the first metal selected from the group consisting of Co and Cu, and contains an etchant, an organic solvent, and an anticorrosive agent. The content of the organic solvent is 80 mass% or greater with respect to the total mass of the processing liquid, and the anticorrosive agent is one or more types of compound selected from the group consisting of a compound X, a compound Y, and a compound Z.
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Inventors:
TAKAHASHI SATOMI (JP)
Application Number:
PCT/JP2020/032679
Publication Date:
March 18, 2021
Filing Date:
August 28, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C11D7/26; H01L21/308; C11D7/32; C11D7/34; C11D7/36; C11D17/08; C23G1/06; H01L21/304; H01L21/306
Domestic Patent References:
| WO2017208749A1 | 2017-12-07 |
Foreign References:
| JP2002523546A | 2002-07-30 | |||
| JP2005522027A | 2005-07-21 | |||
| JP2012084917A | 2012-04-26 | |||
| JP2015122496A | 2015-07-02 | |||
| JP2013157516A | 2013-08-15 | |||
| US20160351388A1 | 2016-12-01 | |||
| JP2016021573A | 2016-02-04 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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