PROTECTIVE COATING COMPOSITION FOR CIRCUIT BOARD

Title:

PROTECTIVE COATING COMPOSITION FOR CIRCUIT BOARD

Document Type and Number:

WIPO Patent Application WO/2021/075664

Kind Code:

A2

Abstract:

Provided in the present disclosure is a protective coating composition for a circuit board, capable of i) forming a protective coating for effectively protecting a circuit board and electrical/electronic components, which are mounted thereto, from moisture, foreign matter and corrosive gases, ii) reducing protective coating formation time, iii) forming a protective coating that can exhibit optimal protective performance at a smaller thickness, and iv) forming a protective coating that is more readily removable. One embodiment of a protective coating composition for a circuit board, according to one aspect of the present disclosure, comprises a polyketone and a solvent.

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Inventors:

LEE JUNGHOON (KR)
CHO RAEHONG (KR)
LEE JAESUNG (KR)
PARK GEUNWOO (KR)
PARK JEONGMIN (KR)

Application Number:

PCT/KR2020/008281

Publication Date:

April 22, 2021

Filing Date:

June 25, 2020

Export Citation:

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Assignee:

SAMSUNG ELECTRONICS CO LTD (KR)
LEE JUNGHOON (KR)

International Classes:

C09D161/02; C08L29/12; C09D5/08; C09D5/16; C09D7/20

Attorney, Agent or Firm:

Y.P.LEE,MOCK & PARTNERS (KR)

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