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Title:
RESIN COMPONENT, AND MOLDING METHOD AND MOLDING DEVICE FOR SAME
Document Type and Number:
WIPO Patent Application WO/2018/061905
Kind Code:
A1
Abstract:
An instrument panel 10 comprises a base material part 20 made from a base material M1, and a different material part 30 having a different heating shrinkage from the base material M1, the base material part 20 and different material part 30 being connected in such a manner that at least part of the two materials do not overlap.

Inventors:
MORIIZUMI TAIKI (JP)
KAMI YUUKI (JP)
HIRANO NOBORU (JP)
SAIMURA TOSHIHIRO (JP)
MIYAMOTO HAJIME (JP)
YUSA ATSUSHI (JP)
KAWANO KAZUHIRO (JP)
Application Number:
PCT/JP2017/033827
Publication Date:
April 05, 2018
Filing Date:
September 20, 2017
Export Citation:
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Assignee:
HONDA MOTOR CO LTD (JP)
International Classes:
B29C45/16
Domestic Patent References:
WO2013146312A12013-10-03
Foreign References:
JP2009051121A2009-03-12
JP2013075447A2013-04-25
JP2005104319A2005-04-21
Attorney, Agent or Firm:
SATO & ASSOCIATES (JP)
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