Title:
RESIN COMPOSITION, CURED PRODUCT, LAMINATE, CURED PRODUCT MANUFACTURING METHOD, LAMINATE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/101296
Kind Code:
A1
Abstract:
The present invention pertains to: a resin composition which contains a polyimide precursor and fillers, and in which the fillers include a filler A1 that satisfies the following condition 1 and/or condition 2 and a filler B that is different from the filler A1; a cured product; a laminate; a cured product manufacturing method; a laminate manufacturing method; a semiconductor device manufacturing method; and a semiconductor device. Condition 1: The cation exchange capacity as expressed as Na ions is 0.1 meq/g or more. Condition 2: The anion exchange capacity as expressed as Cl ions is 0.1 meq/g or more.
Inventors:
YAMASHITA KOSUKE (JP)
Application Number:
PCT/JP2023/039836
Publication Date:
May 16, 2024
Filing Date:
November 06, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08L79/08; B32B27/20; B32B27/34; C08K3/013; H05K1/03
Domestic Patent References:
| WO2013021895A1 | 2013-02-14 | |||
| WO2011062137A1 | 2011-05-26 |
Foreign References:
| JP2006199782A | 2006-08-03 | |||
| JP2022018374A | 2022-01-27 | |||
| JP2014133783A | 2014-07-24 | |||
| JP2009275114A | 2009-11-26 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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