Title:
RESIN COMPOSITION FOR FILM AND PROCESS FOR PRODUCING FILM USING THE SAME
Document Type and Number:
WIPO Patent Application WO/1991/007461
Kind Code:
A1
Abstract:
A resin composition comprising (A) a high density polyethylene having specified MFR, density and melt tension, (B) a propylene polymer having a specified MFR, (C) talc, (D) CaO and/or MgO, and (E) a surfactant, and giving a film which is excellent in strength, water resistance and moldability and has a paper-like texture and rigidity. A film is produced from this composition by an inflation film forming technique wherein the ratio of the bubble diameter to the minimum bubble diameter and the ratio of the length along the film drawing direction of the part having a specific diameter within the bubble to the die diameter are regulated within a predetermined range.
Inventors:
INOUE HIROSHI (JP)
NISHIMURA TOSHIHIRO (JP)
MATSUNAGA TAKASHI (JP)
NISHIMURA TOSHIHIRO (JP)
MATSUNAGA TAKASHI (JP)
Application Number:
PCT/JP1990/001485
Publication Date:
May 30, 1991
Filing Date:
November 15, 1990
Export Citation:
Assignee:
MITSUI PETROCHEMICAL IND (JP)
International Classes:
B29C48/08; B29C48/10; C08J5/18; C08K3/22; C08K3/34; C08K5/103; C08L23/06; C08L23/10; C08K3/00; (IPC1-7): B29C55/28; B29K23/00; C08J5/18; C08K13/02; C08L23/04
Foreign References:
| JPH06363576B | ||||
| JPH06346775B | ||||
| JPS58194936A | 1983-11-14 | |||
| JPH10214424A | 1998-08-11 | |||
| JPS60201926A | 1985-10-12 |
Other References:
See also references of EP 0454870A4
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