Title:
RESIN COMPOSITION FOR INJECTION MOLDING AND INJECTION-MOLDED OBJECT
Document Type and Number:
WIPO Patent Application WO/2020/235241
Kind Code:
A1
Abstract:
This resin composition for injection molding contains a resin component and optionally, an inorganic filler. The resin component contains a poly(3-hydroxyalkanoate)-based resin and a polylactic acid. The content of the polylactic acid is 20 to 50 parts by weight with respect to 100 parts by weight of the total of the poly(3-hydroxyalkanoate)-based resin and the polylactic acid. The content of the inorganic filler is 0 to 40 parts by weight with respect to 100 parts by weight of the total of the poly(3-hydroxyalkanoate)-based resin and the polylactic acid. The weight average molecular weight of the poly(3-hydroxyalkanoate)-based resin is 150,000 to 350,000.
Inventors:
KATSUTA YUTA
NAKAMURA NOBUO
NAKAMURA NOBUO
Application Number:
PCT/JP2020/015643
Publication Date:
November 26, 2020
Filing Date:
April 07, 2020
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08L67/04; C08K3/013; C08L101/16
Domestic Patent References:
| WO2013047766A1 | 2013-04-04 | |||
| WO2017138392A1 | 2017-08-17 | |||
| WO2016114128A1 | 2016-07-21 |
Foreign References:
| JP2012087207A | 2012-05-10 | |||
| JP2013057039A | 2013-03-28 | |||
| JP2005232229A | 2005-09-02 | |||
| JP2005232230A | 2005-09-02 | |||
| JP2005232231A | 2005-09-02 |
Attorney, Agent or Firm:
PATENT CORPORATE BODY ARCO PATENT OFFICE (JP)
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