Title:
RESIN COMPOSITION FOR INSULATING LAYER
Document Type and Number:
WIPO Patent Application WO/2007/114462
Kind Code:
A1
Abstract:
Disclosed is a resin composition characterized by containing (A) a polymerized product of a bismaleimide compound and a diamine compound, (B) an epoxy resin having 2 or more epoxy groups in a molecule, (C) a curing agent and (D) a polyethersulfone resin. This resin composition is suitable for forming an insulating layer of a multilayer printed wiring board or the like. This resin composition is excellent in heat resistance, mechanical strength and laminatability, while having low thermal expansion coefficient.
Inventors:
NARAHASHI HIROHISA (JP)
HAYASHI EIICHI (JP)
HAYASHI EIICHI (JP)
Application Number:
PCT/JP2007/057519
Publication Date:
October 11, 2007
Filing Date:
March 28, 2007
Export Citation:
Assignee:
AJINOMOTO KK (JP)
NARAHASHI HIROHISA (JP)
HAYASHI EIICHI (JP)
NARAHASHI HIROHISA (JP)
HAYASHI EIICHI (JP)
International Classes:
C08G59/54; B32B15/092; B32B27/38; C08G59/20; C08J5/24; C08L63/00; C08L79/08; C08L81/06; C09J7/02; C09J11/00; C09J163/00; C09J179/04; C09J179/08; C09J181/06; H05K3/46
Foreign References:
| JP2002179772A | 2002-06-26 | |||
| JPH11140281A | 1999-05-25 | |||
| JP2005039247A | 2005-02-10 | |||
| JP2003105205A | 2003-04-09 | |||
| JP2005154727A | 2005-06-16 |
Attorney, Agent or Firm:
TAKAHASHI, Fumiko (INC. IntellectualProperty Department,1-1, Suzuki-cho, Kawasaki-ku,Kawasaki-sh, Kanagawa 81, JP)
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