RESIN COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING RESIN COMPOSITION, AND SOLID-STATE IMAGING ELEMENT

Title:

RESIN COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING RESIN COMPOSITION, AND SOLID-STATE IMAGING ELEMENT

Document Type and Number:

WIPO Patent Application WO/2015/115537

Kind Code:

A1

Abstract:

　A resin composition containing (a) an acrylic polymer, (b) a compound having at least one (meth)acryloyl group, and (c) a polymerization initiator, the absolute value of the difference in the refractive index at 100°C between the (a) acrylic polymer and the (b) compound having at least one (meth)acryloyl group being 0.031 or less.

Inventors:

KATOU SADAAKI (JP)
KIMURA MIKA (JP)
IKEDA AYA (JP)
FUJII SHINJIRO (JP)

Application Number:

PCT/JP2015/052505

Publication Date:

August 06, 2015

Filing Date:

January 29, 2015

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD (JP)

International Classes:

C08L33/08; C09J4/00; C09J11/06; C09J133/00; C09J133/14; H01L27/14

Foreign References:

JP2011169828A	2011-09-01
JP2001302870A	2001-10-31
JP2013122577A	2013-06-20
JP2012058725A	2012-03-22

Attorney, Agent or Firm:

HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)

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