Title:
RESIN COMPOSITION FOR SEALING AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/182085
Kind Code:
A1
Abstract:
The present disclosure addresses the problem of providing: a resin composition for sealing that can be used in order to produce a sealing part, the sealing part being capable of having high adhesion with a metal and a semiconductor element; and a semiconductor device comprising said sealing part produced from the resin composition for sealing. The resin composition for sealing contains an epoxy resin (A), a phenolic curing agent (B), an inorganic filler (C), a curing catalyst (D), and an organic metal compound (E). The organic metal compound (E) has a lipophilic group including a straight-chain hydrocarbon group having three or more carbon atoms, and a metal atom bonded to the lipophilic group. The content of the organic metal compound (E) is from 0.1 mass% to 1.5 mass% with respect to the epoxy resin (A).
Inventors:
LIM CHEK KUANG
TAN DAVID
TAN DAVID
Application Number:
PCT/JP2023/009989
Publication Date:
September 28, 2023
Filing Date:
March 15, 2023
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08L63/00; C08K3/013; C08K5/56; H01L23/29; H01L23/31
Foreign References:
| JPH01259066A | 1989-10-16 | |||
| JPS62149743A | 1987-07-03 | |||
| JPH01109753A | 1989-04-26 | |||
| JP2023047606A | 2023-04-06 | |||
| JP2008106181A | 2008-05-08 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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