Title:
RESIN COMPOSITION AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2024/055962
Kind Code:
A1
Abstract:
A resin composition. The resin composition comprises an epoxy resin, a curing agent and a fine silicon powder, wherein the mode diameter of the fine silicon powder is 18-22 μm, and the average particle size of the fine silicon powder is 6-9 μm. The resin composition can have a low viscosity under the condition of a high filling amount of the fine silicon powder, has a relatively low coefficient of thermal expansion (CTE) and a relatively high glass transition temperature Tg after curing, can widen a process window, improve the filling effect, ameliorate the problem of warping which occurs during the encapsulation of an electronic device, and enhance the service reliability of the electronic device.
Inventors:
XU WEINA (CN)
LIU CHENGJIE (CN)
YUAN CAN (CN)
JIN SONG (CN)
ZHU XIAOYI (CN)
CHUANG TEYI (CN)
BAO XUSHENG (CN)
LIU CHENGJIE (CN)
YUAN CAN (CN)
JIN SONG (CN)
ZHU XIAOYI (CN)
CHUANG TEYI (CN)
BAO XUSHENG (CN)
Application Number:
PCT/CN2023/118241
Publication Date:
March 21, 2024
Filing Date:
September 12, 2023
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
C08L63/00; C08G59/40; C08K3/36; H01L23/29
Foreign References:
| CN107216614A | 2017-09-29 | |||
| CN113201204A | 2021-08-03 | |||
| JPH11255864A | 1999-09-21 | |||
| CN112745634A | 2021-05-04 | |||
| JPH0841173A | 1996-02-13 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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