RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Title:

RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Document Type and Number:

WIPO Patent Application WO/1998/001907

Kind Code:

A1

Abstract:

A resin-encapsulated semiconductor device (100) includes a chip mounting portion (10) having a chip mounting surface, a semiconductor chip (20) bonded to the chip mounting surface (12), a plurality of leads (30) spaced from the semiconductor chip (20), a frame lead (36) disposed between these leads (30) and the semiconductor chip (20), various wires (40), and a resin encapsulation portion where the chip mounting portion (10), semiconductor chip (20), part of the leads (30) and frame lead (36) are encapsulated with resin. The leads (30) have first inner leads (32a) discontinuous with the frame lead (36), and second inner leads (32b) integrally continuous with the frame lead (36). This resin-encapsulated semiconductor device has not only high dissipation characteristics but also a high reliability, and, when the leads are rendered sharable, the wire bonding of a high degree of freedom of wiring designing becomes possible.

Inventors:

OTSUKI TETSUYA (JP)
YOSHIMORI KENZO (JP)

Application Number:

PCT/JP1997/002234

Publication Date:

January 15, 1998

Filing Date:

June 27, 1997

Export Citation:

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Assignee:

SEIKO EPSON CORP (JP)
OTSUKI TETSUYA (JP)
YOSHIMORI KENZO (JP)

International Classes:

H01L21/56; H01L23/31; H01L23/433; (IPC1-7): H01L23/50

Foreign References:

JPH0193156A	1989-04-12
JPH0883876A	1996-03-26
JPH0521694A	1993-01-29
JPH04174551A	1992-06-22

Other References: