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Patent Searching and Data


Title:
RESIN MEMBER MOLDING METHOD AND INJECTION MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2002/078926
Kind Code:
A1
Abstract:
A molten resin injection device (15) for injecting molten resin, and an injection molding device connected to the molten resin injection device and communicating with the molten resin injection device so that the molten resin may be injected into the inside, and having a mold (12) internally formed with a cavity of predetermined shape and making it possible to mold the injected molten resin into the predetermined shape are used. In the mold which opens to introduce the molten resin into the outside, a molding subject which becomes a subject of the molding of a resin member with the opening closed is positioned. And, in this state, a plate-like member (10) which is a molding subject and the mold (12) are pressed against each other, and, further, the molten resin is injected into the mold in this pressed state, whereby the molten resin closely adheres to the molding subject as it is led out of the opening. Thereby, a resin member of predetermined shape can be easily and quickly formed on the surface of the molding subject.

Inventors:
KAMIYA KOUJI (JP)
KONDOH TOSHIAKI (JP)
HAZAMA SYUUICHI (JP)
TANAKA TAKANORI (JP)
FUJIWARA KOSYUN (JP)
Application Number:
PCT/JP2002/003272
Publication Date:
October 10, 2002
Filing Date:
April 01, 2002
Export Citation:
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Assignee:
DAIWA KASEI INDUSTRY CO LTD (JP)
TOYOTA MOTOR CO LTD (JP)
KAMIYA KOUJI (JP)
KONDOH TOSHIAKI (JP)
HAZAMA SYUUICHI (JP)
TANAKA TAKANORI (JP)
FUJIWARA KOSYUN (JP)
International Classes:
B29C45/26; B29C45/14; B29C45/27; B29C45/46; B29C45/56; B29C45/64; B60J1/00; B60R1/04; B29C43/18; B29C45/33; B29L31/30; (IPC1-7): B29C45/14; B29C43/18; B29C43/34; B29C45/56
Foreign References:
US6083433A2000-07-04
JPH01317734A1989-12-22
JPS6461217A1989-03-08
JPH0935338A1997-02-07
JP2000071283A2000-03-07
JPH0353915A1991-03-07
Other References:
See also references of EP 1391285A4
Attorney, Agent or Firm:
Sugawara, Seirin (Sakae 2-chome Naka-ku Nagoya-shi, Aichi, JP)
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