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Title:
RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2024/101390
Kind Code:
A1
Abstract:
A resist composition containing a resin component (A1) having a structural unit (a0) derived from a compound represented by general formula (a0-1) (In the formula, R is a hydrogen atom, a C1-5 alkyl group, or a C1-5 halogenated alkyl group; La01 and La02 are each independently a single bond or a divalent linking group; Ar is an aromatic ring; Ra01 is a substituent other than a hydroxy group; m1 is an integer greater than or equal to 0, provided that valence requirements are met; and Rpg is an acid-dissociable group represented by general formula (a0-pg).)

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Inventors:
KOBAYASHI RYOTA (JP)
KATO HIROKI (JP)
Application Number:
PCT/JP2023/040221
Publication Date:
May 16, 2024
Filing Date:
November 08, 2023
Export Citation:
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Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
G03F7/039; C08F12/34; G03F7/20
Domestic Patent References:
WO2023008346A12023-02-02
Foreign References:
JP2022007909A2022-01-13
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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