Title:
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND WAFER
Document Type and Number:
WIPO Patent Application WO/2023/112520
Kind Code:
A1
Abstract:
Provided is a semiconductor device capable of suppressing significant deviation of mutual superposition of connection pads. This semiconductor device comprises: two semiconductor layers; and a wiring layer on one side in a laminating direction and a wiring layer on the other side in the laminating direction, that are interposed between the semiconductor layers, that each include a plurality of sets being provided to an insulating layer and each including a connection pad, wiring, and a via for connecting the connection pad and the wiring, and that are electrically connected to each other by joining joint surfaces of the connection pads. All the sets in the wiring layer on one side in the laminating direction are positioned such that the center of each of the connection pads is away from the center of the corresponding via by a first distance in a first direction in a plan view.
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Inventors:
FUJII NOBUTOSHI (JP)
KOTOO KENGO (JP)
KOTOO KENGO (JP)
Application Number:
PCT/JP2022/040523
Publication Date:
June 22, 2023
Filing Date:
October 28, 2022
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/02; H01L21/3205; H01L21/768; H01L23/522; H01L27/146; H04N25/70
Foreign References:
| JP2017034074A | 2017-02-09 | |||
| JP2020043298A | 2020-03-19 | |||
| JP2016181531A | 2016-10-13 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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