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Title:
SEMICONDUCTOR DEVICE HAVING A COPPER PLUG
Document Type and Number:
WIPO Patent Application WO/2011/043869
Kind Code:
A3
Abstract:
Disclosed is a semiconductor device wherein an insulation layer has a copper plug in contact with the last wiring layer of the device. There may also be a barrier layer separating the copper plug from the insulation layer. In a further embodiment, there may also be an aluminum layer between the insulation layer and copper plug. Also disclosed is a process for making the semiconductor device.

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Inventors:
FAROOQ MUKTA G (US)
KINSER EMILY R (US)
MELVILLE IAN D (US)
SEMKOW KRYSTYNA W (US)
Application Number:
PCT/US2010/046268
Publication Date:
June 03, 2011
Filing Date:
August 23, 2010
Export Citation:
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Assignee:
IBM (US)
FAROOQ MUKTA G (US)
KINSER EMILY R (US)
MELVILLE IAN D (US)
SEMKOW KRYSTYNA W (US)
International Classes:
H01L21/60; H01L23/48; H01L23/52
Foreign References:
US20050127530A12005-06-16
US20080090407A12008-04-17
US20090206484A12009-08-20
US6133136A2000-10-17
US20070004206A12007-01-04
Attorney, Agent or Firm:
PETROKAITIS, Joseph (Intellectual Property Law 4822070 Route 5, Hopewell Junction NY, US)
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